dim 200plm33 - f000 igbt chopper module replaces ds5864 - 2 ds5864 - 3 october 2011 (ln 28812 ) caution: th is device is sensitive to electrostatic discharge. users should follow esd handling procedures 1 / 8 www.dynexsemi.com features ? 10s short circuit withstand ? high thermal cycling capability ? soft punch through silicon ? isolated alsic base with aln substrates ? lead free c onstruction applications ? choppers ? motor controllers ? power supplies ? traction auxiliaries the powerline range of high power modules includes half bridge, chopper, dual, single and bi - directional switch configurations covering voltages from 1200v to 6500v and currents up to 2400a. the dim 200plm33 - f 000 is a single switch 33 00v, n - channel enhancement mode, ins ulated gate bipolar transistor (igbt) chopper module configured with the lower arm of the bridge controlled. the igbt has a wide reverse bias safe operating area (rbsoa) . this device is optimised for traction drives and other applications requiring high t hermal cycling capability. the module incorporates an electrically isolated base plate and low inductance construction enabling circuit designers to optimise circuit layouts and utilise grounded heat sinks for safety . ordering information order as: di m 200plm33 - f 000 note: when ordering, please use the complete part number key parameters v ces 33 00v v ce(sat) * (typ) 2.8 v i c (max) 20 0 a i c(pk) (max) 40 0 a * m e asured at the auxiliary terminals fig. 1 circuit configuration outline type cod e: p (see fig. 11 for further information) fig. 2 package 6(g 2 ) 7(e 2 ) 3(e2) 8(c 2 ) 2(k) 1(a/c2)
dim200plm33 - f000 2 /8 caution: this device is sensitive to electrostatic discharge. users should follow esd handling procedures. www.dynexsemi.com absolute maximum ratings stresses above those listed under absolute maximum ratings may cause permanent damage to the device. in extreme conditions, as with all semiconductors, this may incl ude potentially hazardous rupture of the package. appropriate safety precautions should always be followed. exposure to absolute maximum ratings may affect device reliability. t case = 25c unless stated otherwise symbol parameter test conditions max. un its v ces collector - emitter voltage v ge = 0v 33 00 v v ges gate - emitter voltage 20 v i c continuous collector current t case = 9 0 c 20 0 a i c(pk) peak collector current 1ms, t case = 115 c 4 00 a p max max. transistor power dissipation t case = 25 c , t j = 150 c 2.6 k w i 2 t diode i 2 t value C igbt arm v r = 0, t p = 10ms, t j = 125oc 20 ka 2 s diode i 2 t value C diode arm 20 ka 2 s v isol isolation voltage C per module commoned terminals to base plate. ac rms, 1 min, 50hz 6000 v q pd partial discharge C per module ie c1287, v 1 = 35 00v, v 2 = 26 00v, 50hz rms 10 pc thermal and mechanical ratings internal insulation material: aln baseplate material: alsic creepage distance: 33 mm clearance: 20 mm cti (comparative tracking index): ? 350 symbol parameter test condi tions min typ. max units r th(j - c) thermal resistance C th(j - c) thermal resistance C C th(c - h) thermal resistance C j junction temperature transistor - - 150 c diode - - 125 c t stg storage temperature range - - 40 - 1 25 c screw torque mounting C C
dim200plm33 - f000 caution: th is device is sensitive to electrostatic discharge. users should follow esd handling procedures 3 / 8 www.dynexsemi.com electrical characteristics t case = 25 c unless stated otherwise. symbol parameter test conditions min typ max units i ces collector cut - off current v ge = 0v, v ce = v ce s 1 ma v ge = 0v, v ce = v ces , t case = 125 c 15 ma i ges gate leakage current v ge = 20v, v ce = 0v 1 a v ge(th) gate threshold voltage i c = 4 0 ma, v ge = v ce 5 .5 6 .5 7.0 v v ce(sat) ? collector - e mitter saturation voltage v ge = 15v, i c = 20 0a 2. 8 v v ge = 15v, i c = 20 0a, t j = 125 c 3. 6 v i f diode forward current dc 200 a i fm diode maximum forward current t p = 1ms 400 a v f diode forward voltage ? (igbt arm) i f = 20 0a 2.9 v diode forward voltage ? (diode arm) 3.0 v diode forward voltage ? (igbt arm) i f = 20 0a, t j = 125c 3.0 v diode forward voltage ? (diode arm) 3.1 v c i es input capacitance v ce = 25v, v ge = 0v, f = 1mhz 36 nf q g gate charge 15v 5 c c res reverse transfer capacitance v ce = 25v, v ge = 0v, f = 1mhz 0.45 nf l m module inductance 40 nh r int internal transistor resistance 500 ? sc data short circuit current, i sc t j = 125c, v cc = 1000v t p 10s, v ge 15v v ce (max) = v ces C l * x di/dt iec 60747 - 9 930 a note: ? measured at the auxiliary terminals ? measured at the power busbars * l is the circuit inductance + l m
dim200plm33 - f000 4 /8 caution: this device is sensitive to electrostatic discharge. users should follow esd handling procedures. www.dynexsemi.com electrical characteristics t case = 25c unless stated otherwise symbol parameter test conditions min typ. max units t d(off) turn - off delay time i c = 200a v ge = 15v v ce = 1800v c ge = 56nf l s ~ 100nh r g(on) = 16.5 ? r g(off) = 16.5 ? 1.95 s t f fall time 170 ns e off turn - off energy loss 220 mj t d(on) turn - on delay time 1180 ns t r rise time 225 ns e on turn - on energy loss r g(on) = 7.5 ? , r g(off) = 16.5 ? 290 mj q rr diode reverse recovery charge i f = 200a v ce = 1800v di f /dt = 1600a/s 80 c i rr diode reverse recovery current 144 a e rec diode reverse recovery energy 75 mj t case = 125c unless stated otherwise symbol parameter test conditions min typ. max units t d(off) turn - off delay time i c = 200a v ge = 15v v ce = 1800v c ge = 56nf l s ~ 100nh r g(on) = 16.5 ? r g(off) = 16.5 ? 2.2 s t f fall time 190 ns e off turn - off energy loss 265 mj t d(on) turn - on delay time 1150 ns t r rise time 280 ns e on turn - on energy loss r g(on) = 7.5 ? , r g(off) = 16. 5 ? 390 mj q rr diode reverse recovery charge i f = 200a v ce = 1800v di f /dt = 1600a/s 125 c i rr diode reverse recovery current 155 a e rec diode reverse recovery energy 130 mj
dim200plm33 - f000 caution: th is device is sensitive to electrostatic discharge. users should follow esd handling procedures 5 / 8 www.dynexsemi.com fig. 3 typical output characteristics fig. 4 t ypical output characteristics fig. 5 typical switching energy vs collector current fig. 6 typical switching energy vs gate resistance
dim200plm33 - f000 6 /8 caution: this device is sensitive to electrostatic discharge. users should follow esd handling procedures. www.dynexsemi.com fig. 7 diode typical forward characteristics fig. 8 reverse bias safe operating area fig. 9 diode reverse bias safe operating area fig. 10 transient thermal impedance
dim200plm33 - f000 caution: th is device is sensitive to electrostatic discharge. users should follow esd handling procedures 7 / 8 www.dynexsemi.com package details for further package information, please visit our website or contact customer services. all dimensions in mm, unless stated otherwise. do not scale. nominal weight: 750 g module outline type code: p fig. 11 module outline drawing
dim200plm33 - f000 8 /8 caution: this device is sensitive to electrostatic discharge. users should follow esd handling procedures. www.dynexsemi.com important information: this publication is provided for information only and not for resale. the products and information in this publicati on are intended for use by appropriately trained technical personnel. due to the diversity of product applications, the information contained herein is provided as a general guide only and does n ot constitute any guarantee of suitability for use in a spec ific application . the user must evaluate the suitability of the product and the completeness of the product data for the application. the user is responsible for product selection and ensuring all safety and any warning requirements are met. should addi tional product information be needed please contact customer service. although we have endeavoured to carefully compile the information in this publication it may contain inaccuracies or typographical errors. the information is provided without any warra nty or guarantee of any kind. this publication is an uncontrolled document and is subject to change without notice. when referring to it please ensure that it is the most up to date version and has not been superseded. the products are not intended for use in applications where a failure or malfunction may cause loss of life, injury or damage to property. the user must ensure that appropriate safety precautions are taken to prevent or mitigate the consequences of a product failure or malfunction. the p roducts must not be touched when operating because there is a danger of electrocution or severe burning. always use protective safety equipment such as appropriate shields for the product and wear safety glasses. even when disconnected any electric charg e remaining in the product must be discharged and allowed to cool before safe handling using protective gloves. extended exposure to conditions outside the product ratings may affect reliability leading to premature product failure. use outside the produ ct ratings is likely to cause permanent damage to the product. in extreme conditions, as with all semiconductors, this may include potentially hazardous rupture, a large current to flow or high voltage arcing, resulting in fire or explosion. appropriate application design and safety precautions should always be followed to protect persons and property. product status & product ordering: we annotate datasheets in the top right hand corner of the front page, to indicate product status if it is not yet full y approved for production. the annotations are as follows: - target information: this is the most tentative form of information and represents a very preliminary specification. no actual design work on the product has been started. preliminary inform ation: the product design is complete and final characterisation for vo lume production is in progress. the datasheet represents the product as it is now understood but details may change. no annotation: the product has been approved for production and unless otherwise notified by dynex any product ordered will be supplied to the current version of the data sheet prevailing at the time of our order acknowledgement. all products and materials are sol d and services provided subject to dynexs conditions of sale, which are available on request. any brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners. headquarters oper ations customer service dynex semiconductor ltd doddington road, lincoln, lincolnshire, ln6 3lf, united kingdom dynex semiconductor ltd doddington road, lincoln, lincolnshire, ln6 3lf, united kingdom fax: +44(0)1522 500550 fax: +44(0)1522 500020 tel: + 44(0)1522 500500 tel: +44(0)1522 502753 / 502901 web: http://www.dynexsemi.com email: power_solutions@dynexsemi.com ? dynex semiconductor ltd. 2005 technical documentation C not for resale.
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